Manufacturing from chip to complete instrument
Chip manufacturing is performed by our experienced cleanroom processing team in a fully equipped microsystems MEMS cleanroom facility. In this over 1500 m2 area, wafers are handled in a class 100 environment. This is completed by a fully-owned facility, enabling in-house packaging, assembly and test services for prototyping and production.
In addition, Qmicro is in close contact with the MESA+ Research Institute, a center of multidisciplinary knowledge and technological expertise. The combination of expertise, know-how and facilities provides an ideal environment for innovative industrial solutions.
MEMS micro machining capabilities
- Bulk and surface silicon micro-machining, SOI, glass
- Wet, dry etching (high aspect ratio)
- Thin layer deposition
- (metals, insulators, LPCDV, PECVD, low stress silicon nitride)
- Thermal oxidation, TEOS
- Ion implantation
- Aligned wafer bonding and dicing
- Mask generation